| 摘要 |
<p>The present invention relates to a bottom substrate (12) and a top substrate (11) which are broken without inverting a bonding substrate (10). For this, a break device (1) includes first and second transfer units (2,6) and first and second break units (3,5). The first and second transfer units (2,6) downwardly transfer the bonding substrate (10). The first break unit (3) breaks the bottom substrate (12) along a scribe line (13) which is formed on the side of the bottom substrate (12). The second break unit (5) is arranged on the lower side of the first break unit (3). Also, the second break unit (5) breaks the top substrate (11) along the scribe line (13) which is formed on the side of the top substrate (11).</p> |
