| 摘要 |
The present invention relates to a wafer separation sensing device of a chemically mechanical polishing system. As a wafer separation sensing device of a chemically mechanical polishing system performing a chemical mechanical polishing process while pressing a wafer in a lower side of a membrane to a polishing pad, since a path applying static pressure and negative pressure to the wafer is formed in the membrane of a carrier head, and a pressure chamber is formed in an upper side of the membrane, the wafer separation sensing device of the chemical mechanical polishing system senses the separation or position change of the wafer from a pressure change of the path to the wafer by including: a path pressure sensing part measuring the pressure of the path in real time during the chemical mechanical polishing process; and a control part sensing the separation or position change of the wafer from the lower side of the membrane when the path pressure is changed after getting out of a fixed boundary. |
