发明名称 A Thin Type Carrier Plate for Forming the External Electrode and Fabricating Method its
摘要 Provided is a carrier plate for forming an external electrode. In a carrier plate where chip components are fixed to form the external electrode on an outer surface, a first metal plate has first opening holes consisting of a first small diameter and a first large diameter. A second metal plate has second opening holes consisting of a second small diameter and a second large diameter. A lubber plate is formed between the first metal plate and the second metal plate, is filled in the first and the second opening hole, has a small diameter that is smaller than the inner diameters of the first and the second opening hole, and has a support hole inserted into the outer and the inner surface of the chip component.
申请公布号 KR101448827(B1) 申请公布日期 2014.10.13
申请号 KR20120112962 申请日期 2012.10.11
申请人 发明人
分类号 H01C17/00;H01G13/00 主分类号 H01C17/00
代理机构 代理人
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