SOCKET FOR SEMICONDUCTOR PACKAGE TEST

摘要

The present invention provides a test socket for a semiconductor package, including: a contact pin having a lead terminal contact unit which is protruding toward a mounting chamber in order to be connected to a package lead terminal, an elastic support unit which is extended vertically upward from one side of the lead terminal contact unit, and a lower contact terminal protruding to be connected to a test board by being extended downward from the elastic support unit, wherein the elastic support unit is bent to the inside of the mounting chamber when one end thereof is elastically supported by a base and the lead terminal contact unit is pressed by a lead terminal of the semiconductor package, and returned to an original position by a restoring force when the lead terminal of the semiconductor package is disconnected.