| 摘要 |
The present invention relates to an LED package with upper and lower supporting blocks, and more particularly, to an LED package with upper and lower supporting blocks which are provided to upper and lower portions of a lower end side of a shielding housing to enable the LED package to be mounted on or connected to a conductive plate for an LED package, so that the mounting or connecting work can be easily and rapidly performed without requiring high-temperature working environment and any expensive printed circuit boards, and without generating any harmful substances. To this end, according to one aspect of the present invention, provided is an LED package, including: a shielding housing for shielding a light emitting object therein; a conductive frame installed in the shielding housing and connected to one side of the light emitting object to supply electric power to the light emitting object; and a conductive pad electrically connected to a conductive plate by exposing the conductive frame to an outside of a pillar below the shielding housing. The LED package includes an upper supporting block formed on one side of a bottom surface of the shielding housing to serve as connecting and fixing means of the conductive pad and the conductive plate; and a lower supporting block formed on one side of a lower end portion of the pillar to serve as connecting and fixing means of the conductive pad and the conductive plate. |
