发明名称 SURFACE ACOUSTIC WAVE DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a surface acoustic wave device and a method for manufacturing the same, capable of reducing resistance loss and suppressing an IDT electrode from being damaged in a manufacturing step.SOLUTION: A surface acoustic wave device 1 comprises: a piezoelectric substrate 7; an IDT electrode 9 formed on the piezoelectric substrate 7; an electrode pad 11 formed on the piezoelectric substrate 7 and for connecting the IDT electrode 9 to an external terminal; and connection wiring 13 formed on the piezoelectric substrate 7 and connecting the IDT electrode 9 and the electrode pad 11. The IDT electrode 9 has a first thickness. The electrode pad 11 has a second thickness greater than the first thickness. The connection wiring 13 has a thickness greater than the first thickness and smaller than the second thickness. A method for manufacturing the surface acoustic wave device 1 includes a step of applying a resist on the IDT electrode 9 and the connection wiring 13 and patterning the resist so as to cover at least the connection portion between the IDT electrode 9 and the connection wiring 13.</p>
申请公布号 JP2014195312(A) 申请公布日期 2014.10.09
申请号 JP20140107899 申请日期 2014.05.26
申请人 KYOCERA CORP 发明人 OTSUKA KAZUHIRO;NAKAJIMA HISASHI;SAKUSHIMA SHIRO
分类号 H03H9/145;H03H3/08 主分类号 H03H9/145
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