| 摘要 |
<p>PROBLEM TO BE SOLVED: To apply a gettering function to an obtained semiconductor device without performing special processing to a semiconductor wafer and a chip.SOLUTION: The adhesive sheet according to the invention is formed of a base material and an adhesive agent layer laminated on the base material so as to be removed freely. The adhesive agent layer has a first adhesive agent layer and a second adhesive agent layer laminated in this order from a base material face side. The first adhesive agent layer includes an acrylic polymer (A), an epoxy-based thermosetting resin (B) and a thermosetting agent (C). The second adhesive agent layer includes the acrylic polymer (A), the epoxy-based thermosetting resin (B), the thermosetting agent (C) and a gettering agent (D). The first adhesive agent layer includes no gettering agent (D), or concentration of the gettering agent (D) in the first adhesive agent layer is lower than that in the second adhesive agent layer.</p> |
