SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor device includes a package 1, a block-module 2, and a control board 3 for controlling power semiconductor elements 11a. The block-module 2 has embedded power semiconductor elements 11a and second leads 4b and first leads 4a that are drawn from the block-module 2. The package 1 has external connection terminals 6a in contact with the first leads 4a of the block-module 2. The second leads 4b are connected to the control board 3 while the first leads 4a are joined to the external connection terminals 6a.

主权项

1. A semiconductor device comprising:
a block-module having an embedded power semiconductor element, a first lead and a second lead drawn therefrom; a control board for controlling the power semiconductor element; and a package having an opening and an external connection terminal at a bottom of the package, the external connection terminal being in contact with the first lead of the block-module mounted at the bottom, wherein the second lead is connected to the control board while the first lead is joined to the external connection terminal.