| 摘要 |
The reliability of a semiconductor device is improved. A semiconductor device has a first metal plate and a second metal plate electrically isolated from the first metal plate. Over the first metal plate, a first semiconductor chip including a transistor element formed thereover is mounted. Whereas, over the second metal plate, a second semiconductor chip including a diode element formed thereover is mounted. Further, the semiconductor device has a lead group including a plurality of leads electrically coupled with the first semiconductor chip or the second semiconductor chip. The first and second metal plates are arranged along the X direction in which the leads are arrayed. Herein, the area of the peripheral region of the first semiconductor chip in the first metal plate is set larger than the area of the peripheral region of the second semiconductor chip in the second metal plate. |
| 主权项 |
1. A semiconductor device, comprising:
a first semiconductor chip having a first front surface including a first electrode pad and a second electrode pad formed thereover, and a first back surface arranged on the opposite side to the first front surface and including a third electrode formed thereover, the first semiconductor chip including a transistor element electrically coupled with the first and second electrode pads and the third electrode; a second semiconductor chip having a second front surface including a fourth electrode pad formed thereover, and a second back surface arranged on the opposite side to the second front surface and including a fifth electrode formed thereover, the second semiconductor chip including a diode element electrically coupled with the fourth electrode pad and the fifth electrode; a first metal plate having a first chip mounting part including the first semiconductor chip mounted thereover, and electrically coupled with the third electrode of the first semiconductor chip; a second metal plate having a second chip mounting part including the second semiconductor chip mounted thereover, and electrically coupled with the fifth electrode of the second semiconductor chip; a lead group including a lead electrically coupled with the first semiconductor chip, and a lead electrically coupled with the second semiconductor chip; and a sealing body for sealing the first and second semiconductor chips, and respective portions of a plurality of the leads, wherein the first and second metal plates are electrically isolated from each other, and are arranged adjacent to each other along a first direction, wherein the lead group is arranged in such a manner as to face to the first metal plate and the second metal plate along a second direction orthogonal to the first direction, and respective leads are arranged along the first direction, and wherein, in plan view, the width in the first direction of a portion of the first metal plate including the first chip mounting part is larger than the width in the first direction of a portion of the second metal plate including the second chip mounting part. |
