发明名称 NIOBIUM OXIDE SPUTTERING TARGET, PRODUCTION METHOD THEREOF AND NIOBIUM OXIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a niobium oxide sputtering target capable of direct-current (DC) sputtering, and to provide a production method thereof.SOLUTION: A niobium oxide sputtering target is produced by a production method having a reduction step for obtaining oxygen deficiency niobium oxide powder by applying a reduction treatment to the niobium oxide powder, a mixing step for reducing dispersion of the oxygen content in the obtained oxygen deficiency niobium oxide powder as the need arises, and a sintering step for obtaining a sintered body in a non-oxidative atmosphere. The specific resistance in the whole area in the thickness direction of the sintered body is 0.001 to 0.05 &OHgr;-cm.
申请公布号 JP2014194072(A) 申请公布日期 2014.10.09
申请号 JP20140023246 申请日期 2014.02.10
申请人 MITSUBISHI MATERIALS CORP 发明人 UMEMOTO KEITA;CHO SHUHIN
分类号 C23C14/34;B22F1/00;C04B35/00 主分类号 C23C14/34
代理机构 代理人
主权项
地址