ELECTROLYTIC COPPER FOR PLATING AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide electrolytic copper being copper of a small massive shape to form into the feed source of copper upon copper plating, in which the content of impurities is low, and a method for producing the same.SOLUTION: Provided is electrolytic copper with a columnar shape in which sulfur (S) impurity concentration is 5 ppm or lower, and the ratio between the height difference D(mm) and the diameter R(mm) of the electrolytic copper, (D/R) being below 0.08, and also provided is a method for producing electrolytic copper in which a circular opening part is formed at a resist, and electrolytic copper is electrodeposited on the opening part, in which the thickness H(mm) of the resist and current density A(A/dm) satisfy the conditions of A<-18×H+10.