| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a component incorporated wiring board at low cost while securing reliability of semiconductor chip connection and functionality as a wiring board.SOLUTION: A metal foil on a first dielectric plate is patterned to form a wiring pattern including a plurality of land regions. Paste of a solder containing at least tin is printed and deposited collectively all over one surface on the first dielectric plate continued to the plurality of land regions. The first dielectric plate is heated to melt the solder contained in the paste, and a tin-containing metal coating is formed only on the plurality of land regions by utilizing that the solder is moved onto the plurality of land regions, aggregated and re-coagulated by wetness on the plurality of land regions. A plurality of gold bumps of a semiconductor chip component are abutted to the tin-containing metal coating, the semiconductor chip component is flip-connected, and a second dielectric plate that is another dielectric plate is integrated while being laminated on the first dielectric plate so as to embed the semiconductor chip component in the second dielectric plate.</p> |
