METHOD OF CONTROLLING A THERMAL BUDGET OF AN INTEGRATED CIRCUIT DEVICE, AN INTEGRATED CIRCUIT, A THERMAL CONTROL MODULE AND AN ELECTRONIC DEVICE THEREFOR

摘要

A method of controlling a thermal budget of an integrated circuit device is described. The method comprises obtaining a first junction temperature measurement value for the integrated circuit device at a first time instant, and a further junction temperature measurement value for the integrated circuit device at a further time instant. The method further comprises calculating a prospective junction temperature value for the integrated circuit device at a future time instant based at least partly on the first and further junction temperature measurement values; and configuring an operating condition of the integrated circuit device based at least partly on the calculated prospective junction temperature value.

主权项

1. A method of controlling a thermal budget of an integrated circuit device; the method comprising:
obtaining a first junction temperature measurement value for the integrated circuit device at a first time instant; obtaining at least one further junction temperature measurement value for the integrated circuit device at an at least one further time instant; calculating a prospective junction temperature value for the integrated circuit device at a future time instant based at least partly on the first junction temperature measurement value and the at least one further junction temperature measurement value; and configuring at least one operating condition of the integrated circuit device based at least partly on the calculated prospective junction temperature value.