Non-Invasive Segmentable Three-Dimensional Microelectrode Array Patch For Neurophysiological Diagnostics And Therapeutic Stimulation

摘要

Implementations disclosed herein provide for a microneedle electrode system comprising a microneedle electrode patch connected to external electronics. The microneedle electrode patch comprises a first flexible substrate having a plurality of conductive pads disposed thereon, a plurality of three-dimensional, individually addressable microneedle electrode arrays where each array has a plurality of microneedles extending from an upper surface thereof and a lower surface adapted to contact a corresponding one of the plurality of conductive pads disposed on the first substrate, and a second flexible substrate having a plurality of openings defined therein dimensioned to accommodate at least a portion of the upper surface of the microneedle electrode array from which the microneedles extend. Each of the conductive pads is disposed in electrical communication with a corresponding one of the plurality of microneedle electrode arrays and the first and second substrate are bonded together such that each one of the plurality of microneedle electrode arrays extends through a corresponding one of the plurality of openings defined in the second substrate.

主权项

1. A microneedle electrode patch, comprising:
a first flexible substrate having a surface, a lateral edge and at least one conductive pad, wherein a corresponding at least one conductive trace extends from the conductive pad disposed on the surface proximate a lateral edge of the first flexible substrate, at least one microneedle electrode array formed from a conductive substrate having a plurality of microneedles extending from at least a portion of an upper surface thereof and a lower surface adapted to contact a corresponding one of the at least one conductive pad on the first substrate, wherein the microneedle electrode array further comprises a coating, and a second flexible substrate having at least one opening defined therein dimensioned to accommodate at least the portion of the upper surface of one of the at least one microneedle electrode array from which the plurality of microneedles extend; wherein the at least one conductive pad and the at least one microneedle electrode array are disposed in electrical communication and the first substrate and second substrate are bonded together.