MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE

摘要

Provided is a member for semiconductor manufacturing device which hardly causes component contamination and is capable of sufficiently reducing generation of particles in a semiconductor manufacturing device. A spray coating is formed by spraying a ceramic onto a mounting member of a transfer arm, and laser beam is irradiated to the spray coating to remelt and resolidify the ceramic composition for modification to thereby form a high-strength ceramic layer made from a ceramic recrystallized material and having a net-like crack, whereby particles dropped out from the mounting member due to external factors in a semiconductor manufacturing device are reduced to an extent not affecting a semiconductor manufacturing process.

主权项

1. A member for semiconductor manufacturing device comprising a base member for forming a semiconductor manufacturing device, and a ceramic spray coating applied on a surface of the base member, characterized in that a surface layer of the ceramic spray coating is provided with a high-strength ceramic layer for reducing particles dropped out from the member for semiconductor manufacturing device due to external factors in the semiconductor manufacturing device to an extent not affecting a semiconductor manufacturing process, and the high-strength ceramic layer is made from a ceramic recrystallized material formed by spraying a ceramic onto the surface of the base member to form a thermal spray coating and then irradiating the surface thereof with a laser beam or an electron beam to remelt and resolidify a ceramic composition of the surface layer of the thermal spray coating for modification, and a net-like crack is formed in the high-strength ceramic layer.