HERMETIC PACKAGING OF INTEGRATED CIRCUIT COMPONENTS

摘要

A method for forming an integrated circuit includes transforming at least a portion of a first substrate layer to form a conductive region within the first substrate layer. An integrated circuit device is provided proximate an outer surface of the first substrate layer. The integrated circuit device transmits or receives electrical signals through the conductive region. A second substrate layer is disposed proximate to the outer surface of the first substrate layer to enclose the integrated circuit device in a hermetic environment.

主权项

1. A hermetically-packaged integrated circuit, comprising:
a first substrate layer comprising a dielectric region operable to perform as a capacitor for the transfer of electrical signals, the dielectric region positioned proximate an outer surface of the first substrate layer, the dielectric region formed from a thermal process performed on the first substrate layer; an integrated circuit device positioned proximate the outer surface of the first substrate layer; and a second substrate layer disposed proximate the outer surface of the first substrate layer to enclose the integrated circuit device in a hermetic environment.