SUBSTRATE GRIPPING DEVICE AND SUBSTRATE PROCESSING APPARATUS

摘要

A rotary table; a drive motor M configured to rotate the rotary table; a pin base supported by the rotary table; a pin fixing member configured to move closer to or away from C1 upon the pin base revolving; first chuck pins and second chuck pins provided on the pin fixing member and configured to be into contact with an outer edge of the substrate W; a substrate gripping force generation mechanism including a spring member; a chuck pin switching mechanism including an inertia member configured to be rotated coaxially with the rotary table and a protruded member provided on an outer peripheral part of the inertia member; and a cum member provided on the pin fixing member and configured to engage with protruded member.

主权项

1. A substrate gripping device for rotating a substrate while gripping outer edge portions of the substrate, the substrate gripping device comprising:
a rotary table configured to be rotated;
a drive portion configured to rotate the rotary table;first and second chuck pins provided on the rotary table and configured to be into contact with an outer edge of the substrate;an inertia member disposed coaxially with the rotary table and configured to be rotated relative to the rotary table; anda chuck pin switching mechanism configured to change chucking states of the first and second chuck pins relative to the substrate by utilizing a relative movement between the rotary table and the inertia member upon a change in rotational speed of the rotary table.