发明名称 LED DEVICE MANUFACTURING METHOD AND LED DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of an LED device which uses a thermosetting resin composition for light reflection which has high reflectance in visible light to near-ultraviolet light after curing, and excellent in heat aging resistance and tablet moldability, and which is unlikely to cause burrs at the time of transfer molding.SOLUTION: An LED device manufacturing method at least comprises: a process of molding a resin composition which contains (A) epoxy resin, (B) a cure agent, (C) a hardening accelerator, (D) an inorganic filler, (E) a white pigment and (F) a coupling agent and further contains a nano-particle filler having a central grain diameter of 1 nm-1000 nm as (H) a thickening agent to form a reflector 103 on metal wiring 105 except at least one optical semiconductor element mounting region 200; a process of mounting an LED chip on the optical semiconductor element mounting region 200; and a process of electrically connecting the LED chip and the metal wiring 105.
申请公布号 JP2014195106(A) 申请公布日期 2014.10.09
申请号 JP20140103155 申请日期 2014.05.19
申请人 HITACHI CHEMICAL CO LTD 发明人 KOTANI HAYATO;URASAKI NAOYUKI;YUASA KANAKO;NAGAI AKIRA;HAMADA MITSUYOSHI
分类号 H01L33/60;H01L33/50;H01L33/56;H01L33/62 主分类号 H01L33/60
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