发明名称 STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS
摘要 Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
申请公布号 US2014299359(A1) 申请公布日期 2014.10.09
申请号 US201414247033 申请日期 2014.04.07
申请人 Innova Dynamics, Inc. 发明人 Mittal Alexander Chow;Srinivas Arjun Daniel;Robinson Matthew R.;Young Michael Eugene
分类号 H05K1/09;B05D3/00;H05K1/02;B05D1/00 主分类号 H05K1/09
代理机构 代理人
主权项 1. A manufacturing method to form a transparent conductive electrode, comprising: providing a wet composition on a substrate; applying metallic nanowires to the wet composition to at least partially embed the metallic nanowires into the wet composition; and converting the wet composition into a coating with the metallic nanowires at least partially embedded into the coating, wherein converting the wet composition includes at least one of curing, cross-linking, and polymerizing the wet composition.
地址 San Francisco CA US