发明名称 |
STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS |
摘要 |
Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes. |
申请公布号 |
US2014299359(A1) |
申请公布日期 |
2014.10.09 |
申请号 |
US201414247033 |
申请日期 |
2014.04.07 |
申请人 |
Innova Dynamics, Inc. |
发明人 |
Mittal Alexander Chow;Srinivas Arjun Daniel;Robinson Matthew R.;Young Michael Eugene |
分类号 |
H05K1/09;B05D3/00;H05K1/02;B05D1/00 |
主分类号 |
H05K1/09 |
代理机构 |
|
代理人 |
|
主权项 |
1. A manufacturing method to form a transparent conductive electrode, comprising:
providing a wet composition on a substrate; applying metallic nanowires to the wet composition to at least partially embed the metallic nanowires into the wet composition; and converting the wet composition into a coating with the metallic nanowires at least partially embedded into the coating, wherein converting the wet composition includes at least one of curing, cross-linking, and polymerizing the wet composition. |
地址 |
San Francisco CA US |