发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device concerning an embodiment is provided with a semiconductor layer, an impurity-doped layer selectively formed on the semiconductor layer, and a drain electrode formed on the impurity-doped layer. The semiconductor device is further provided with a source electrode which is formed and isolated from the drain electrode, and a gate electrode which is formed between the source electrode and the drain electrode. The semiconductor device is provided with an insulating film which is formed between the gate electrode and the drain electrode, and a shielding plate which is formed on the insulating film and is electrically connected to the source electrode. At least a part of the shielding plate is formed above an extending portion of the impurity-doped layer which extends in the direction to the gate electrode from the drain electrode.
申请公布号 US2014299946(A1) 申请公布日期 2014.10.09
申请号 US201414311072 申请日期 2014.06.20
申请人 Kabushiki Kaisha Toshiba 发明人 Yamamura Takuji
分类号 H01L29/40 主分类号 H01L29/40
代理机构 代理人
主权项 1. A semiconductor device, comprising a semiconductor layer; an impurity-doped layer which is formed on the semiconductor layer; a drain electrode which is formed on the impurity-doped layer; a source electrode which is isolated from the drain electrode and is formed above the semiconductor layer; a gate electrode which is formed between the source electrode and the drain electrode and is isolated from the impurity-doped layer; an insulating film which is formed between the gate electrode and the drain electrode, and which covers the semiconductor layer and an extending portion of the impurity-doped layer which extends in the direction which faces to the gate electrode from the drain electrode; and a shielding plate which is formed on the insulating film and is electrically connected to the source electrode, wherein at least a part of the shielding plate is formed above the extending portion of the impurity-doped layer.
地址 Minato-ku JP