| 发明名称 |
RESIN COMPOSITION FOR COPPER CLAD LAMINATE, RESIN-COATED COPPER USING SAME, COPPER CLAD LAMINATE, AND PREPARATION METHOD THEREFOR |
| 摘要 |
<p>The present invention relates to: a resin composition comprising a high-equivalent epoxy resin, a low-equivalent epoxy resin and a tetrafunctional epoxy resin; a resin-coated copper (RCC) using the resin composition; a copper clad laminate using basic materials of the RCC and a glass web; and a preparation method therefor.</p> |
| 申请公布号 |
WO2014163427(A1) |
申请公布日期 |
2014.10.09 |
| 申请号 |
WO2014KR02921 |
申请日期 |
2014.04.04 |
| 申请人 |
DOOSAN CORPORATION |
发明人 |
LEE, HANG SEOK;HAN, DUK SANG;KIM, SUNG MOON;PARK, IL GEUN;MOON, SUNG JOON |
| 分类号 |
C08L63/02;B32B15/092;B32B37/10;C08G59/18 |
主分类号 |
C08L63/02 |
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