| 摘要 |
The present invention provides an adapter that, when a small-diameter semiconductor substrate (small substrate) is processed using a semiconductor-manufacturing apparatus corresponding to a large-diameter silicon substrate, the small substrate is vacuum-fixed to an adapter plate resolving the dimensional difference, and thereby prevents the small substrate from falling even in the vertical or inversion direction. To apply the small substrate in the semiconductor-manufacturing apparatus corresponding to a large-diameter silicon substrate, a structure is provided to enable delivery and processing. In the structure, an opening section (10) is drilled in a delivery base section (1) comprising the large diameter silicon substrate, and a polyimide film (2) is adhesively laminated on the rear surface of the delivery base section (1) so as to enable vacuum chucking or electrostatic chucking of the small substrate. The structure is provided with a construction (7) partially covering the opening section (10), the construction (7) comprising a substrate insertion section (7b) and a substrate accommodating section (7c) into which the small substrate is inserted and accommodated. |
