发明名称 CURABLE RESIN COMPOSITION FOR COATING/PROTECTING MATERIALS FOR LIGHT-EMITTING SEMICONDUCTORS
摘要 A curable resin composition which comprises (A) an epoxy resin having a silicone backbone and (B) an epoxy resin curing agent, optionally contains (C) a curing accelerator, and has such a property that a cured product thereof has a refractive index of 1.44 or more and less than 1.499 at 663 nm and 25˚C. It is preferred that the epoxy resin curing agent (B) is a polycarboxylic acid resin or a polycarboxylic acid.
申请公布号 WO2014163122(A1) 申请公布日期 2014.10.09
申请号 WO2014JP59783 申请日期 2014.04.02
申请人 NIPPONKAYAKU KABUSHIKIKAISHA 发明人 NOGUCHI JUNYA;KAWADA YOSHIHIRO
分类号 C08G59/20;C08G59/42;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G59/20
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