发明名称 CURABLE RESIN COMPOSITION
摘要 <p>The purpose of the present invention is to provide, as a material that is particularly suitable for relay sealing applications, a curable resin composition which exhibits excellent storage stability, such as fluid characteristics and viscosity at room temperature or when refrigerated, while maintaining adhesive strength. The present invention relates to a curable resin composition that contains components (A) to (D). (A) 100 parts by mass of an epoxy resin, (B) 0.01-1 parts by mass of a chelate-forming compound, (C) 1-50 parts by mass of a component that cures the epoxy resin, and (D) 0.5-50 parts by mass of acrylic rubber particles</p>
申请公布号 WO2014163155(A1) 申请公布日期 2014.10.09
申请号 WO2014JP59876 申请日期 2014.04.03
申请人 THREEBOND FINE CHEMICAL CO., LTD. 发明人 KOJIMA KAZUHIRO;HA KHOI-NGUYEN;MORITOKI TATSUYA
分类号 C08L63/00;C08K5/17;C08L51/00 主分类号 C08L63/00
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