发明名称 Molded polyamide resin article
摘要 Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50 % and a moisture content of 0.1 to 2 % by mass.
申请公布号 AU2011313399(B8) 申请公布日期 2014.10.09
申请号 AU20110313399 申请日期 2011.09.29
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