发明名称 INSULATING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide, for example, an insulating substrate that allows directly detecting peeling and cracks.SOLUTION: An insulating substrate includes a transparent insulating layer, a first metal layer provided on one surface of the transparent insulating layer, and a second metal layer provided on the other surface on the opposite side of the one surface of the transparent insulating layer. An exposed portion where the first metal layer is not provided is formed on the one surface of the transparent insulating layer, and the second metal layer is provided so as to include a region overlapping with the exposed portion when viewed from a vertical direction with respect to the one surface.
申请公布号 JP2014194988(A) 申请公布日期 2014.10.09
申请号 JP20130070466 申请日期 2013.03.28
申请人 TOYOTA MOTOR CORP 发明人 HAYASHI HIROMASA
分类号 H01L23/12;H01L23/34 主分类号 H01L23/12
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