| 摘要 |
PROBLEM TO BE SOLVED: To precisely process a light guide plate containing three-dimensional complex shaped groove, with depth and planar shape changing minutely, without sacrificing a processing speed.SOLUTION: In a light guide plate processing apparatus 1, a cutting chip C containing a blade tip made from SiC single crystal is attached to a tool holder 20 which is fitted to a process head 10 capable of movement in XYZ direction and rotation around Z axis. The process head 10 is fitted with a laser displacement sensor 30 as well. Two piezo stacks 51, 52 and a displacement magnification lever 60 are assembled to the tool holder 20, and a chip holder 61 is floating-supported on a central lower part of the displacement magnification lever 60 through an elastic link member 65. A process data is added with a surface condition measured with the laser displacement sensor 30, and then distributed to piezo stack drive control data and process head drive control data, for performing groove processing in combination with piezo stroke. |
