发明名称 PROCESS OF MANUFACTURING PATTERN STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a process of manufacturing a pattern structure capable of relatively reducing an amount of coating of a lift-off material and enhancing thickness uniformity of the lift-off material.SOLUTION: The process of manufacturing a pattern structure includes forming a lift-off material 12 on a substrate 10 using a coating applicator 20 having a brush 34. Next, on the substrate 10 and the lift-off material 12, a functional film 14 is formed by an atomic layer deposition method. Next, by removing the lift-off material 12 by a lift-off method, a pattern 14a is formed from the functional film 14 on the substrate 10.
申请公布号 JP2014195015(A) 申请公布日期 2014.10.09
申请号 JP20130071129 申请日期 2013.03.29
申请人 SUMITOMO CORP;MITSUBISHI PENCIL CO LTD 发明人 MURAKAMI TETSUYA;MIYAGAWA TAKASHI;ITO HIROYUKI;ICHIKAWA HIDETOSHI;TAKIGAWA SEIICHI
分类号 H01L21/027;B05C1/02;H01L21/306 主分类号 H01L21/027
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