发明名称 |
PROCESS OF MANUFACTURING PATTERN STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a process of manufacturing a pattern structure capable of relatively reducing an amount of coating of a lift-off material and enhancing thickness uniformity of the lift-off material.SOLUTION: The process of manufacturing a pattern structure includes forming a lift-off material 12 on a substrate 10 using a coating applicator 20 having a brush 34. Next, on the substrate 10 and the lift-off material 12, a functional film 14 is formed by an atomic layer deposition method. Next, by removing the lift-off material 12 by a lift-off method, a pattern 14a is formed from the functional film 14 on the substrate 10. |
申请公布号 |
JP2014195015(A) |
申请公布日期 |
2014.10.09 |
申请号 |
JP20130071129 |
申请日期 |
2013.03.29 |
申请人 |
SUMITOMO CORP;MITSUBISHI PENCIL CO LTD |
发明人 |
MURAKAMI TETSUYA;MIYAGAWA TAKASHI;ITO HIROYUKI;ICHIKAWA HIDETOSHI;TAKIGAWA SEIICHI |
分类号 |
H01L21/027;B05C1/02;H01L21/306 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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