| 发明名称 |
POLISHING COMPOSITION |
| 摘要 |
A polishing composition containing at least water and silica and satisfying all of the following conditions (a) through (d) is provided. Condition (a) The specific surface area of the silica contained in the polishing composition is 30 m2/g or more. Condition (b) Silica having a particle size of 10 to 50 nm is contained in the amount of 2% by mass or more. Condition (c) Silica having a particle size of 60 to 300 nm is contained in the amount of 2% by mass or more. Condition (d) The value obtained by dividing the average particle size of the silica specified in the condition (c) by the average particle size of the silica specified in the condition (b) is 2 or more. |
| 申请公布号 |
US2014302753(A1) |
申请公布日期 |
2014.10.09 |
| 申请号 |
US201214355625 |
申请日期 |
2012.11.06 |
| 申请人 |
FUJIMI INCORPORATED |
发明人 |
Morinaga Hitoshi;Asano Hiroshi;Serikawa Masayuki |
| 分类号 |
C09G1/02;B24B37/04 |
主分类号 |
C09G1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing composition comprising at least water and silica. wherein the composition satisfies all the following conditions:
(a) the specific surface area of the silica contained in the polishing composition is 30 m2/g or more; (b) the polishing composition contains 2% by mass or more of silica having a particle size of 10 to 50 nm; (c) the polishing composition contains 2% by mass or more of silica having a particle size of 60 to 300 nm; and (d) a value obtained by dividing the average particle size of the silica specified in the condition (c) by the average particle size of the silica specified in the condition (b) is 2 or more. |
| 地址 |
Kiyosu-shi, Aichi JP |
