发明名称 OPTICAL DEVICES AND METHODS OF FABRICATING THE SAME
摘要 Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer d an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.
申请公布号 US2014302623(A1) 申请公布日期 2014.10.09
申请号 US201414311372 申请日期 2014.06.23
申请人 Electronics and Telecommunications Research Institute 发明人 HAN Young-Tak;PARK Sang Ho;LEE Dong-Hun;SHIN Jang Uk;HAN Sang-Pil;BAEK Yongsoon
分类号 G02B6/136;H01L23/00 主分类号 G02B6/136
代理机构 代理人
主权项 1. A method of fabricating an optical device, the method comprising: sequentially forming a lower-clad layer, a platform core, and an upper-clad layer on a substrate having a waveguide region and a mounting region; performing a first etch process on the upper-clad layer, the platform core, and the lower-clad layer disposed on the mounting region of the substrate to form a PLC waveguide in the waveguide region and a lower-clad layer having a first height in the mounting region; performing a second etch process on the lower-clad layer having the first height disposed on the mounting region of the substrate to form a terrace having the first height and a trench and a lower-clad layer having a second height; forming a chip alignment mark on a mounting surface of an optical active chip comprising a chip core therein; and mounting the optical active chip on the mounting region of the substrate, wherein the optical active chip is aligned by interlocking between the trench of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.
地址 Daejeon KR