QUAD FLAT NON-LEAD PACKAGE

摘要

A quad flat non-lead package includes a chip, a chip carrier including a bearing surface adapted for the mounting of the chip, a plurality of leads mounted around the chip carrier and electrically connected to the chip, each lead having an opening located in an outer edge of a rear end thereof, and a molding compound formed on the chip, the chip carrier and the leads by compression molding to let the opening of each lead be exposed to the outside. The design of the openings of the leads can provide more tin-climbing area to improve soldering quality and yield, thereby lowering the manufacturing cost and facilitating testing after the soldering process. The invention also provides a lead frame for quad flat non-lead package.

主权项

1. A quad flat non-lead package, comprising:
a chip; a chip carrier comprising a bearing surface adapted for the mounting of said chip; a plurality of leads mounted around said chip carrier and electrically connected to said chip, each said lead comprising an opening located in an outer edge of a rear end thereof; and a molding compound formed on said chip, said chip carrier and said leads by compression molding to let the opening of each said lead be exposed to the outside of said molding compound.