发明名称 |
Semiconductor Device and Method for Fabricating the Same |
摘要 |
Provided is a semiconductor device. The semiconductor device includes a fin on a substrate; a gate electrode cross the fin on the substrate; a source/drain formed on at least one of both sides of the gate electrode, and including a first film and a second film; and a stress film arranged between an isolation film on the substrate and the source/drain, and formed on a side surface of the fin. |
申请公布号 |
US2014299934(A1) |
申请公布日期 |
2014.10.09 |
申请号 |
US201414194837 |
申请日期 |
2014.03.03 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
KIM Seok-Hoon;KWON Tae-Ouk;JUNG Su-Jin;KIM Young-Pil;LEE Byeong-Chan;KOO Bon-Young |
分类号 |
H01L29/78 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
|
主权项 |
1. A semiconductor device comprising:
a substrate; an isolation film on the substrate; a fin projecting away from the substrate through a recess in the isolation film; a gate electrode that crosses the fin; a source/drain formed on a side of the gate electrode, the source/drain including a first film and a second film; and a stress film that is on a side surface of the fin, the stress film positioned between the isolation film and the source/drain. |
地址 |
Suwon-si KR |