发明名称 |
Semiconductor Device Including a Gate Trench and a Source Trench |
摘要 |
A semiconductor device includes a source trench extending into a semiconductor body from a first surface of the semiconductor body. A source trench dielectric and a source trench electrode are in the source trench. A gate trench dielectric and a gate trench electrode are in a gate trench extending into the semiconductor body from the first surface. A body region of a first conductivity type is between the gate and source trenches. A source region of a second conductivity type different from the first conductivity type is between the gate and source trenches. An interconnection electrically couples the body region and the source trench electrode. The interconnection adjoins a lateral face of the source trench electrode and the body region. A source contact is on the source trench electrode at the first surface. |
申请公布号 |
US2014299932(A1) |
申请公布日期 |
2014.10.09 |
申请号 |
US201313856689 |
申请日期 |
2013.04.04 |
申请人 |
INFINEON TECHNOLOGIES AUSTRIA AG |
发明人 |
Blank Oliver |
分类号 |
H01L29/417;H01L29/10;H01L29/423;H01L29/78;H01L29/66 |
主分类号 |
H01L29/417 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device, comprising:
a source trench extending into a semiconductor body from a first surface of the semiconductor body; a source trench dielectric and a source trench electrode in the source trench; a gate trench dielectric and a gate trench electrode in a gate trench extending into the semiconductor body from the first surface; a body region of a first conductivity type between the gate and source trenches; a source region of a second conductivity type different from the first conductivity type between the gate and source trenches; an interconnection electrically coupling the body region and the source trench electrode, wherein the interconnection adjoins a lateral face of the source trench electrode and of the body region; and a source contact on the source trench electrode at the first surface. |
地址 |
Villach AT |