发明名称 PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plating device capable of suppressing the generation of the deflection of a workpiece in a plating tank and more reducing variation in the distribution of plating thickness.SOLUTION: Provided is a plating device subjecting a long-length sheet-shape workpiece to plating treatment. The plating device comprises exhaust ports for exhausting a plating liquid formed at the side wall of a plating tank.
申请公布号 JP2014194064(A) 申请公布日期 2014.10.09
申请号 JP20130113365 申请日期 2013.05.29
申请人 SUMITOMO METAL MINING CO LTD 发明人 NAGANO SHINSAKU
分类号 C25D7/06;C25D5/08;C25D5/56;H05K3/18 主分类号 C25D7/06
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