CONNECTION STRUCTURE OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a connection structure of an electronic component which can improve connection reliability.SOLUTION: With respect to a lead frame 2, right below an electrode 41b provided for a lower surface of a chip capacitor 4, a reception surface 21 away from the chip capacitor 4 is formed in the direction where another lead frame paired with the lead frame 2 is present from a fulcrum supporting the chip capacitor 4. A solder 5 is stayed between the reception surface 21 and the electrode 41b.