发明名称 DIE HEAD, MANUFACTURING METHOD OF THE SAME, AND MANUFACTURING METHOD OF FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a die head in which occurrence of crack in providing a DLC film for a base of the die head is suppressed, a manufacturing method of die head, and a manufacturing method of film.SOLUTION: A casting die includes a detachable die head 82 at a dope outlet. The die head 82 has a base 85, a foundation layer 92, and a DLC film 86. The base 85 consists of stainless steel. The foundation layer 92 consists of tungsten carbide (WC). The DLC film 86 is formed on the foundation layer 92. In forming the DLC film 86, combination of a coefficient of linear expansion between the base 85 and the foundation layer 92, a length LY of the base 85 in a longitudinal direction, heating temperature in a vapor phase film deposition method is determined such that stress that works on the foundation layer 92, which is obtained from external force caused by thermal expansion distortion between the base 85 and the foundation layer 92, becomes less than rupture stress of the foundation layer 92. The foundation layer 92 and the DLC film 86 are formed based on the combination.</p>
申请公布号 JP2014193601(A) 申请公布日期 2014.10.09
申请号 JP20140024319 申请日期 2014.02.12
申请人 FUJIFILM CORP 发明人 UEDA TADASHI
分类号 B29C41/36;B29C41/24;B29L7/00;C23C14/06;C23C16/27 主分类号 B29C41/36
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