| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a microwave processor which can cool a workpiece efficiently, without a significant impact on the behavior of microwave in a processing container.SOLUTION: A heat absorption layer 50 is provided on the inner wall of the ceiling 11, sidewall 12 and bottom 13 of the processing container 2 of a microwave processor 1. Preferably, the heat absorption layer 50 is provided at least in a region facing a wafer W, on the inner wall surface of the ceiling 11 and bottom 13. Preferably, the heat absorption layer 50 is composed of a material having an emittance higher than that of a member facing the wafer W, and a small loss of microwave when it passes, e.g., a material having a dielectric loss tangent (tanδ) of 10or less at the frequency of a microwave used, and a dielectric constant of 3 or less.</p> |
