| 发明名称 |
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, METHOD FOR MANUFACTURING STACKED CHIP COMPONENT AND METHOD FOR MOUNTING ELECTRONIC COMPONENT |
| 摘要 |
A connection device includes a mounting section on which an electronic component stacked with a thermosetting adhesive agent layer is mounted, a heat press head for heating and pressing the electronic component, a first elastic body that is disposed between the electronic component and a pressing surface of the heat press head so as to press an upper surface of the electronic component, and a support member that is disposed on a periphery of the electronic component and supports the first elastic body. |
| 申请公布号 |
US2014302643(A1) |
申请公布日期 |
2014.10.09 |
| 申请号 |
US201214355852 |
申请日期 |
2012.10.31 |
| 申请人 |
Dexerials Corporation |
发明人 |
Saito Takayuki |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A connection device comprising:
a mounting section on which an electronic component stacked with a thermosetting adhesive agent layer is mounted; a heat press head for heating and pressing the electronic component; a first elastic body that is disposed between the electronic component and a pressing surface of the heat press head so as to press an upper surface of the electronic component; and a support member that is disposed on a periphery of the electronic component and supports the first elastic body. |
| 地址 |
Tokyo JP |
