Thermal conductive epoxy composites and their applications for light emitting diode fixtures

摘要

The present invention relates to an epoxy composite resin composition with heat conductivity and to a preparing method thereof. The epoxy composite resin composition of the present invention comprises multiple components wherein a multi-functional epoxy resin, a curing agent, graphite which is a filler, and a single or a combination of silicon carbide are included. The epoxy composite resin composition in the present invention has heat-dissipating rate which is higher than that of an existing heat-dissipating plate, so the epoxy composite resin composition in the present invention can be used in heat-dissipating structures as materials of coating the surface of the heat-dissipating plate.