发明名称
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical device wafer, with which the optical device wafer in which the surface of an optical device layer is unevenly formed can be efficiently manufactured. SOLUTION: The method of manufacturing the optical device wafer having the optical device layer laminated on the surface of a sapphire substrate includes: an unevenness forming step of forming fine uneven waviness on the surface of the sapphire substrate by grinding the surface of the sapphire substrate; and an optical device layer-forming step of laminating and forming the optical device layer on the surface of the sapphire substrate on which the unevenness forming process is performed. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5603085(B2) 申请公布日期 2014.10.08
申请号 JP20100001101 申请日期 2010.01.06
申请人 发明人
分类号 H01L21/304;B24B1/04;B24B7/19;B24B41/047 主分类号 H01L21/304
代理机构 代理人
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