| 摘要 |
A method for manufacturing a printed circuit board is provided to reduce the thickness of the printed circuit board by reclaiming a circuit pattern inside an insulating member. A first area and a second area are formed between a first insulating member(111) and a second insulating member(112). A separation member(130) is arranged in the first area. The first and second insulating members are attached through the second area. The first and second insulating members are attached by the thermo-compression bonding method. The separation member is not attached to the first and second insulating members in the thermo-compression bonding process. The first and second conductive layers are formed in an outer surface of the first and second insulating members. A circuit pattern(123) is formed in a part of the first and second conductive layers. The first and second insulating members are separated based on the separation member. |
