发明名称 |
HOUSING FOR ACCOMMODATING AN ELECTRONIC CIRCUIT |
摘要 |
A housing for receiving an electronic circuit (4) having a plurality of components (5) having a carrier plate (7) and a housing cover (8) including a circumferentially enclosing wall (9) on the carrier plate (7) and a cover part (10) on the wall (9), which cover part (10) lies opposite the carrier plate (7). A volume compensation element (11) is attached on the carrier plate (7) in an interior (12) of the housing cover (8) which is enclosed in a pressure-tight manner from an external atmosphere. The volume compensation element (11) is elastically formed providing a variable volume for compensation of pressure fluctuations in the interior (12), which variable volume occurs with a change in position of the volume compensation element (11) relative to the carrier plate (7). A gap between the volume compensation element (11) and the carrier plate (7) is connected to the external atmosphere. |
申请公布号 |
EP2786646(A1) |
申请公布日期 |
2014.10.08 |
申请号 |
EP20110801633 |
申请日期 |
2011.11.30 |
申请人 |
EBM-PAPST MULFINGEN GMBH&CO. KG |
发明人 |
SAUER, Thomas;BEST, Dieter;MATTER, Walter;BERBERICH, Joachim |
分类号 |
H02J3/24;H02J3/32;H02K5/10;H05K5/06 |
主分类号 |
H02J3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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