发明名称 |
POLISHING LIQUID COMPOSITION FOR SILICON WAFERS |
摘要 |
<p>A polishing composition for a silicon wafer, includes a macromolecular compound, an abrasive, and an aqueous medium. The macromolecular compound includes a constitutional unlit (a1) represented by the following general formula (1), a constitutional unit (a2) represented by the following general formula (2), and a constitutional unit (a3) represented by the following general formula (3). The total of the constitutional unit (a3) is 0.001 to 1.5 mol% of all the constitutional units of the macromolecular compound.</p> |
申请公布号 |
EP2444996(A4) |
申请公布日期 |
2014.10.08 |
申请号 |
EP20100797104 |
申请日期 |
2010.07.05 |
申请人 |
KAO CORPORATION |
发明人 |
SUZUKI, MASAHIKO;OKAMURA, MAMI;OI, TOSHIAKI |
分类号 |
H01L21/304;B24B37/00;C09G1/02;C09K3/14 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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