发明名称 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE POSITION CORRECTION METHOD
摘要 In STEP 1, a mapping operation is carried out by a mapping device. In STEP 2, based on position information for the wafer (W) detected by the mapping operation, it is determined whether or not a wafer (W) position is in an abnormal state or not. When the wafer position is determined to be in the abnormal state (Yes), a closing/opening operation, in which a FOUP door (19c) is temporarily closed and then opened, is carried out in STEP 3. In STEP 4, the number of times the FOUP door (19c) is closed/opened (in other words, the number of times a port door (62) is closed/opened) is counted, and in STEP 5, it is determined whether or not this count value is less than a preset value. If the count value is less than the preset value (Yes), the processing in STEP 1-STEP 5 is repeated once again.
申请公布号 KR20140119013(A) 申请公布日期 2014.10.08
申请号 KR20147018899 申请日期 2013.01.08
申请人 TOKYO ELECTRON LIMITED 发明人 KAI KOZO;CHIKUMA TAKAMASA;OSADA KEIJI;LI CHUNMUI
分类号 H01L21/67;H01L21/673;H01L21/677 主分类号 H01L21/67
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