发明名称
摘要 A method of performing alignment of an array of probe tips of a probe card to corresponding contact pads for wafer probing applications by performing the steps of: obtaining a backside image of the wafer; overlaying a mapping of the contact pads over the backside image; selecting contact pads as landing points; obtaining an image of the probe tips array; comparing the landing points to corresponding positions of probe tips; and, if the positions of probe tips are not aligned with the landing point, rotating the probe card to align the positions of probe tips to the landing points.
申请公布号 JP5602415(B2) 申请公布日期 2014.10.08
申请号 JP20090260094 申请日期 2009.11.13
申请人 发明人
分类号 H01L21/66;G01R31/28 主分类号 H01L21/66
代理机构 代理人
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