发明名称 EPOXY/VINYL COPOLYMER-TYPE LIQUID RESIN COMPOSITION, CURED ARTICLE THEREOF, ELECTRICAL/ELECTRONIC DEVICE USING SAID CURED ARTICLE, AND METHOD FOR PRODUCING SAID CURED ARTICLE
摘要 The present invention provides an epoxy-vinyl copolymerization type liquid resin composition and a cured product of the same. The resin composition contains: an epoxy resin having an epoxy resin equivalent of not more than 200 g/eq; an acid anhydride having an unsaturated double bond that is liquid at normal temperature or the acid anhydride having an unsaturated double bond that is liquid at normal temperature and maleic anhydride; a polyfunctional monomer which is liquid at normal temperature; an epoxy resin curing catalyst which accelerates a curing reaction of the epoxy resin with the acid anhydride or with the acid anhydride and maleic anhydride; and a radical polymerization catalyst which accelerates a curing reaction of the polyfunctional monomer. This makes it possible to reduce varnish viscosity and to enhance heat resistance of the cured product. Further, it is also possible to provide a cured product formed by curing the thermosetting resin composition, and to provide an electronic/electric apparatus in which the cured product is used as an insulating material or/and a structural material.
申请公布号 KR20140119075(A) 申请公布日期 2014.10.08
申请号 KR20147021464 申请日期 2013.02.19
申请人 HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD. 发明人 AMOU SATORU
分类号 C08G59/20;C08G59/42;C08K3/36;C08K7/04;C08L63/00;H01B3/40 主分类号 C08G59/20
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