SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing apparatus is disclosed. According to an embodiment of the present invention, the substrate processing apparatus comprises a plurality of processing chambers which carry out vapor deposition of a substrate; a transfer chamber provided between the processing chambers and forming a space to deliver a pattern forming member which forms vapor deposition pattern on a substrate to the processing chamber; and a pattern forming member returning unit provided inside the transfer chamber and carrying the pattern forming member to and from inside the processing chambers, which are provided on both sides of the transfer chamber, by expanding and contracting.