SOLDER RESIST COMPOSITION IMPROVED THERMAL CONDUCTION RATE

摘要

The present invention relates to a solder resist composition with improved thermal conductivity and a method for manufacturing the same and, more specifically, to a solder resist composition with improved thermal conductivity which is characterized by including nitrates with three sizes. According to the present invention, provided is a solder resist composition having high thermal conductivity and emissivity by not using aluminum and including nitrates of three sizes and being easily applied to various products to increase possibility of commercialization.