| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a pressure vessel having an extended communication chamber for semiconductor packaging, and a pressure vessel used for providing uniform heating in semiconductor packaging processing.SOLUTION: A pressure vessel having an extended communication chamber for semiconductor packaging is disclosed. The pressure vessel includes a cavity having a reception space for storing a heater therein. The reception space is connected to a pressure source via a pressure control assembly so that it is maintained at predetermined pressure. The cavity is connected to the extended communication chamber. The extended communication chamber is coupled to a motor accommodation chamber for accommodating a motor therein. The motor accommodation chamber is maintained at constant room pressure by the extended communication chamber and the cavity. The reception space of the cavity includes a turbo fan attached therein. The motor drives and rotates the turbo fan, and gas in the reception space of the cavity flows, thereby uniformly heating a heating object arranged in the pressure vessel.</p> |
