| 摘要 |
The present invention provides solder powder and solder paste using the same. The solder powder is rarely molten again and bonding strength is also rarely decreased after a reflow process. Especially, the solder powder is proper to be used for installing electrical parts, exposed to an environment at high temperatures. The soldering powder (10) is composed of a core (11) and a cover layer (12), which covers the core (11). The core (11) is made of silver and a compound of silver and tin. The cover layer (12) is made of tin. An average diameter of a solder powder particle is 30μm or smaller. The solder powder (10) includes more than 10 wt% and 70 wt% or less of silver with respect to 100 wt% of the total weight of the solder powder (10). |
